PS21563-P Integrated Circuit IC Chip IGBT 3 Phase 600V 10A 35 Power DIP Driver Module

PS21563-P Power Driver Module IGBT 3 Phase 600V 10A 35-PowerDIP Module

Feature

• Employing 5th generation planar IGBT chips with 0.6µm design rule

or CSTBT™ technology with superior loss performance

• Ultra compact dual or single-in-line transfer mold package

(compatible with 2nd generation)

• Including driver and protection circuitry (UV, SC)

• DIP-IPM with reduction of thermal resistance by 20%

• 2500Vrms isolation voltage

• High-active interface logic for direct connection to a 3V or 5V MCU

• Highest reliability and optimised EMI performance

• Available from 3A to 50A / 600V for motor ratings from 0.1kW to 3.7kW

• Optional with open emitter topology for vector control

• All Mitsubishi DIP and Mini-DIP-IPMs have lead-free terminals

• From January 2006 onwards, all DIP and Mini-DIP-IPMs will

be supplied with completely lead-free technology